| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of a device as a whole, and to decrease a power consumption amount.SOLUTION: A heat treatment device which performs heat treatment to an object 1 placed in a device main body 10 comprises: a cover body 30 which positions the object 1 in a substantially-sealed space by being arranged in a form for covering the surroundings of the object 1; an induction heating coil 40 which is arranged in the device main body 10 in a state that a heat insulation plate 11 is interposed between the object 1 and itself, heats a heat generation body 20 for placing the object 1 by induction heating when being driven, and indirectly heats the object 1; atmosphere adjusting means which supplies an inert gas to a space formed of the cover body 30, and adjusts an atmosphere of the space; and a control part 70 which performs the heating treatment of the object 1 by driving the induction heating coil 40 when a heat treatment command is imparted, and on the other hand, when the heating treatment of the object 1 is performed, stops the drive of the induction heating coil 40, increases the supply of the inert gas by the atmosphere adjusting means, and performs the cooling treatment of the object 1. |
