Heat Transfer Management Apparatuses Having A Composite Lamina

摘要

Heat transfer management apparatuses are disclosed. In one embodiment, a heat transfer management apparatus includes a composite lamina having an insulator substrate and a plurality of thermal conductor traces coupled to the insulator substrate, where the plurality of thermal conductor traces are arranged into a first enhanced thermal conduction region and a second enhanced thermal conduction region. The heat transfer management apparatus also includes a heat generating component mount coupled to the composite lamina and a temperature sensitive component mount coupled to the composite lamina and positioned distally from the heat generating component mount. At least one of the plurality of thermal conductor traces is in electrical continuity with the heat generating component mount and the temperature sensitive component mount, and at least one of the plurality of thermal conductor traces is electrically isolated from at least one of the heat generating component mount or the temperature sensitive component mount.

主权项

1. A heat transfer management apparatus comprising:
a composite lamina comprising an insulator substrate and a plurality of thermal conductor traces coupled to the insulator substrate, where the plurality of thermal conductor traces are arranged into a first enhanced thermal conduction region and a second enhanced thermal conduction region, wherein at least one of the plurality of thermal conductor traces in the first enhanced thermal conduction region extends in a direction that is transverse to at least one of the thermal conductor traces in the second enhanced thermal conduction region; a heat generating component mount coupled to the composite lamina; and a temperature sensitive component mount coupled to the composite lamina and positioned distally from the heat generating component mount, wherein: at least one of the plurality of thermal conductor traces is in electrical continuity with the heat generating component mount and the temperature sensitive component mount; and at least one of the plurality of thermal conductor traces is electrically isolated from at least one of the heat generating component mount or the temperature sensitive component mount.