POLYIMIDES AS LASER RELEASE MATERIALS FOR 3-D IC APPLICATIONS

摘要

The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.

主权项

1. A temporary bonding method comprising:
providing a stack comprising:
a first substrate having a back surface and a front surface;a bonding layer adjacent said front surface; anda second substrate having a first surface, said first surface including a polyimide release layer adjacent said bonding layer, wherein said polyimide release layer is formed from a composition comprising a polymer dissolved or dispersed in a solvent system, said polymer comprising recurring monomers selected from the group consisting of fluorinated dianhydrides, photosensitive dianhydrides, photosensitive diamines, and combinations thereof; and exposing said polyimide release layer to laser energy so as to facilitate separation of said first and second substrates.