发明名称 |
CIRCUIT STRUCTURE |
摘要 |
Provided is a circuit structure capable of suppressing worsening of radiation properties that is caused by a cavity caused by a protrusion being formed that enters inside an opening formed in a substrate. Also provided is a production method whereby this kind of circuit structure can be easily produced. The circuit structure 1 has: a protrusion 21 formed in a conductive member 20, said protrusion 21 entering inside an opening 12 formed in a substrate 10 and having a terminal 33 of an electronic component 30 connected thereto; a cavity 22 that occurs as a result of the formation of the protrusion 21 and is covered by a base member 90 that supports the conductive member 20; and a buried member 40 having higher thermal conductivity than air, provided inside the cavity 22. |
申请公布号 |
WO2016013363(A1) |
申请公布日期 |
2016.01.28 |
申请号 |
WO2015JP69023 |
申请日期 |
2015.07.01 |
申请人 |
AUTONETWORKS TECHNOLOGIES, LTD.;SUMITOMO WIRING SYSTEMS, LTD.;SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
NAKAMURA, ARINOBU |
分类号 |
H05K1/18;H02G3/16;H05K1/02 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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