| 主权项 |
1. A liquid cooled device enclosure, which is used for cooling electronic components having high heat dissipation, comprising:
at least one device enclosure, a plurality of device chassis sidewalls located vertical to the ground correspondingly, a plurality of device chassis slotted walls which is vertical to the ground and forms a device chassis by connecting with the device chassis sidewalls, at least one lower lid which is located parallel to the ground on the part of the device chassis facing the ground, at least one upper lid which is parallel to the lower lid, vertical to the device chassis sidewalls and the device chassis slotted walls, and covers the device chassis, a plain liquid channel which is located on the device chassis sidewalls, at least one electronic module compartment which is located on the inner surfaces of the device chassis slotted walls, an electronic module compartment sidewall which is the surface of the electronic module compartment facing a device chassis front panel, a plurality of electronic module compartment slotted walls which is the inner surface of the electronic module compartments facing each other, at least one slot which is present on the electronic module compartment slotted walls correspondingly and in which a plurality of electronic modules are located, at least one inlet liquid quick coupling which is present on the outer surface of the device chassis and through which liquid enters into the device chassis, at least one outlet liquid quick coupling which is present on the outer surface of the device chassis and through which liquid exits out of the device chassis, a plurality of liquid channels which corresponds to the slot and are present on the electronic module compartment slotted walls, at least one micro channel which is present on the liquid channels corresponding to the slot, at least one device front panel which provides an interface for a device connectors and protects the front surface of the device chassis by covering. |
