| 发明名称 |
SUPPORT MEMBER |
| 摘要 |
An apparatus to cool an electronic module is provided herein. The apparatus includes a support member and a retaining member. The support member to receive the cooling module. The support member includes a cooling module alignment member to align the cooling module therein. The retaining member to secure the cooling module. |
| 申请公布号 |
US2016029510(A1) |
申请公布日期 |
2016.01.28 |
| 申请号 |
US201314771800 |
申请日期 |
2013.03.14 |
| 申请人 |
Hewlett-Packard Development Company, L.P. |
发明人 |
Cader Tahir;Franz John P.;Kolas Jon;Moore David A. |
| 分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus to cool an electronic module, the apparatus comprising:
a support member to receive a cooling module, the support member includes a cooling module alignment member to align the cooling module with a cooling module connector at a front portion of the cooling module; and a retaining member to secure the cooling module therein. |
| 地址 |
Houston TX US |
