发明名称 Methods of Forming Capacitors
摘要 A method of forming a capacitor includes depositing a dielectric metal oxide layer of a first phase to a thickness no greater than 75 Angstroms over an inner conductive capacitor electrode material. The first phase dielectric metal oxide layer has a k of at least 15. Conductive RuO2 is deposited over and into physical contact with the dielectric metal oxide layer. Then, the RuO2 and the dielectric metal oxide layer are annealed at a temperature below 500° C. The RuO2 in physical contact with the dielectric metal oxide during the annealing facilitates a change of the dielectric metal oxide layer from the first phase to a second crystalline phase having a higher k than the first phase. The annealed dielectric metal oxide layer is incorporated into a capacitor dielectric region of a capacitor construction. Other implementations are disclosed.
申请公布号 US2016027642(A1) 申请公布日期 2016.01.28
申请号 US201514877677 申请日期 2015.10.07
申请人 Micron Technology, Inc. 发明人 Antonov Vassil N.;Bhat Vishwanath
分类号 H01L21/02;H01L21/3105;H01L49/02 主分类号 H01L21/02
代理机构 代理人
主权项 1. A method of forming a capacitor, comprising: depositing inner conductive capacitor electrode material over a substrate, the inner conductive capacitor electrode material being selected from the group consisting of conductively doped silicon, elemental titanium, elemental tungsten, elemental ruthenium, elemental platinum, and mixtures thereof; depositing a dielectric metal oxide layer of a first phase over the inner conductive capacitor electrode material; providing one or more different capacitor dielectric layers intermediate the first phase dielectric metal oxide and the inner conductive capacitor electrode material; depositing conductive RuO2 over and into physical contact with the dielectric metal oxide layer; after depositing the conductive RuO2, annealing the RuO2 and the dielectric metal oxide layer at a temperature below 500° C.; the RuO2 in physical contact with the dielectric metal oxide during the annealing facilitating a change of the dielectric metal oxide layer from the first phase to a second crystalline phase having a higher k than the first phase; after the annealing, etching utilizing an etch chemistry comprising O3 to selectively remove at least some of the RuO2; and incorporating the annealed dielectric metal oxide layer into a capacitor dielectric region of a capacitor construction.
地址 Boise ID US