HYBRID MEMORY BLADE

摘要

The present invention is directed to server systems and methods thereof. More specifically, embodiments of the present invention provides a memory controller within a server system, where the memory controller is disengageably connected to one or more processors, a plurality of volatile memory modules, and plurality of solid-state memory modules. This memory controller may be connected to other similarly configured memory controllers. The volatile and solid-state memory modules can be removed and/or replaced. There are other embodiments as well.

主权项

1. A method of operating a server system, the method comprising:
in a network configured with the server system comprising:
an optical interconnect;a top of rack switch apparatus coupled to the optical interconnect;an enclosure having a plurality of mounting interfaces for a plurality of servers, each of the servers being coupled to the top of the rack switch apparatus;a first blade housing structure configured with a length of no more than 900 mm and a width of no more than 500 mm, the first blade housing structure is disengageably coupled to at least one of the mounting interfaces;a first memory controller module comprising a first processor interface, a plurality of volatile memory interface, a plurality of solid-state memory interfaces, and a plurality of cascade interfaces, the first memory controller being disengageably mounted on the first blade housing structure;a first processor disengageably mounted to a first mounting interface of the enclosure, the processor being connected to the memory controller via the first processor interface;a plurality of volatile memory modules disengageably mounted to a plurality of memory mounting interfaces of the first blade housing structure;a plurality of solid-state memory modules disengageably mounted to a plurality of memory solid state interfaces of the first blade housing structure;a power management system positioned with the enclosure;a network interface positioned within the enclosure; anda thermal management system positioned within the enclosure;wherein the first processor interface is a QPI interface, HT interface, or ARM processor interface, a high speed serial interface, or a PCI-e interface; andoperating the server system.