发明名称 DYNAMIC RANDOM ACCESS MEMORY CELL WITH SELF-ALIGNED STRAP
摘要 After formation of trench capacitors and source and drain regions and gate structures for access transistors, a dielectric spacer is formed on a first sidewall of each source region, while a second sidewall of each source region and sidewalls of drain regions are physically exposed. Each dielectric spacer can be employed as an etch mask during removal of trench top dielectric portions to form strap cavities for forming strap structures. Optionally, selective deposition of a semiconductor material can be performed to form raised source and drain regions. In this case, the raised source regions grow only from the first sidewalls and do not grow from the second sidewalls. The raised source regions can be employed as a part of an etch mask during formation of the strap cavities. The strap structures are formed as self-aligned structures that are electrically isolated from adjacent access transistors by the dielectric spacers.
申请公布号 US2016027788(A1) 申请公布日期 2016.01.28
申请号 US201514874390 申请日期 2015.10.03
申请人 International Business Machines Corporation 发明人 Barth, JR. John E.;Cheng Kangguo;Ho Herbert L.;Khakifirooz Ali;Ramachandran Ravikumar;Rim Kern;Vega Reinaldo A.
分类号 H01L27/108;H01L29/66;H01L21/311;H01L29/417;H01L21/02 主分类号 H01L27/108
代理机构 代理人
主权项 1. A method of forming a semiconductor structure comprising: forming a trench capacitor in a substrate; forming a semiconductor fin including a source region and a drain region on said substrate; forming a dielectric material portion contacting a first sidewall of said source region, wherein a second sidewall of said source region is physically exposed after formation of said dielectric material portion; forming a raised source region on said second sidewall of said source region; and forming a conductive strap structure on an inner electrode of said trench capacitor and on a sidewall of said raised source region.
地址 Armonk NY US