| 摘要 |
The invention relates to a carrier for an electrical component, in particular for a semiconductor laser, having a substrate with a surface, wherein an electrically conductive contact surface is arranged on the surface of the substrate, wherein a solder pad is arranged on the contact surface, wherein a solder resist structure is provided laterally next to the solder pad, wherein the solder resist structure is configured to make wetting with liquid solder more difficult compared with the contact surface, wherein the solder resist structure subdivides the contact surface into a first surface region with the solder pad and into a second surface region, wherein the first and the second surface region are connected together. |
