| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
This semiconductor device (1) comprises a wiring substrate (2), a semiconductor chip (3) and a sealing body (4). The wiring substrate (2) includes an insulating base material (2a), a first conductive pattern (12) formed on one surface of the insulating base material (2a), and a second conductive pattern (13) formed on one surface of the insulating base material (2a), connected to the first conductive pattern (12) and having an end face exposed to the side. The semiconductor chip (3) is mounted on the wiring substrate (2a) so as to overlap with the first conductive pattern (12). The sealing body (4) is formed on the wiring substrate (2a) so as to cover the semiconductor chip (3). |
| 申请公布号 |
US2016029491(A1) |
申请公布日期 |
2016.01.28 |
| 申请号 |
US201414771662 |
申请日期 |
2014.03.04 |
| 申请人 |
TOMOHIRO Atsushi |
发明人 |
Tomohiro Atsushi |
| 分类号 |
H05K1/18;H05K1/02;H05K1/11 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a wiring substrate having an insulating base material, a first conductive pattern formed on a first surface of the insulating base material, and a second conductive pattern formed on the first surface of the insulating base material, connected to the first conductive pattern, and exposed to the side at an end face; a semiconductor chip mounted on the wiring substrate so as to overlie the first conductive pattern; and a sealing body formed on the wiring substrate so as to cover the semiconductor chip. |
| 地址 |
US |
