发明名称 SOLID-STATE IMAGING APPARATUS, METHOD FOR MANUFACTURING THE SAME, AND IMAGING SYSTEM
摘要 A solid-state imaging apparatus, comprising a first semiconductor region of a first conductivity type provided on a substrate by an epitaxial growth method, a second semiconductor region of the first conductivity type provided on the first semiconductor region, and a third semiconductor region of a second conductivity type provided in the second semiconductor region so as to form a pn junction with the second semiconductor region, wherein the first semiconductor region is formed such that an impurity concentration decreases from a side of the substrate to a side of the third semiconductor region, and an impurity concentration distribution in the second semiconductor region is formed by an ion implantation method.
申请公布号 US2016027825(A1) 申请公布日期 2016.01.28
申请号 US201414489812 申请日期 2014.09.18
申请人 CANON KABUSHIKI KAISHA 发明人 Moriyama Takashi;Minowa Masaaki;Ichikawa Takeshi;Ogawa Masahiro
分类号 H01L27/146;H04N5/265;H04N5/232;H04N5/33;H04N5/374 主分类号 H01L27/146
代理机构 代理人
主权项 1. A solid-state imaging apparatus comprising: a first semiconductor region of a first conductivity type provided on a substrate by an epitaxial growth method; a second semiconductor region of the first conductivity type provided on the first semiconductor region; and a third semiconductor region of a second conductivity type provided in the second semiconductor region such that a pn junction is formed between the second semiconductor region and the third semiconductor region, wherein the first semiconductor region is formed such that an impurity concentration of the first semiconductor region decreases as a position within the first semiconductor region goes from a side of the substrate toward a side of the third semiconductor region, and an impurity concentration distribution in the second semiconductor region is formed by an ion implantation method.
地址 Tokyo JP