SYSTEMS AND METHODS FOR RELIABLE INTEGRATED CIRCUIT DEVICE TEST TOOLING

摘要

In one embodiment of the present invention, a test probe assembly for testing packaged integrated circuit (IC) devices includes a plurality of probes, a pad and a PCB/interposer. The plurality of probes is configured to repeatedly maintain reliable electrical contact with a corresponding plurality of DUT contacts when under a compliant force. The pad provides mechanical support and/or electric coupling for the plurality of probes. In turn, the PCB/interposer supports the pad. In some embodiments, the plurality of probes includes a hard core material such as diamond. In other embodiments, the surface of the probes is hardened

主权项

1. A test probe assembly useful for testing packaged integrated circuit (IC) devices, the test probe assembly comprising:
a plurality of probes configured to repeatedly maintain reliable electrical contact with a corresponding plurality of DUT contacts when under a compliant force, each of the plurality of probes having a hard core; a pad configured to support the plurality of probes; and a PCB configured to support the pad.