METHOD FOR PRODUCING CONNECTION STRUCTURE

摘要

Provided is a method for producing a connection structure which is capable of suppressing the amount of change in impedance. A method for producing a connection structure according to the present invention comprises: a step for arranging a conductive paste on the surface of a first connection object member; a step for arranging a second connection object member on the surface of the conductive paste such that a first electrode and a second electrode face each other; and a step for electrically connecting the first electrode and the second electrode by means of a solder part in a connection part by heating the conductive paste to a temperature that is not less than the melting point of solder particles and is not less than the curing temperature of a thermosetting component. The thickness of the solder part is set to be larger than the average particle diameter of the solder particles and to be 80 μm or less.