EPOXY RESIN COMPOSITION AND ELECTRONIC PART DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition that is excellent in flowability, dimensional stability and low stress, and a highly reliable electronic part device comprising an element sealed thereby.SOLUTION: The epoxy resin composition includes: (A) an epoxy resin; and a premixture of (B) a curing agent and (C) a silicone compound. The silicone compound (C) contained in the premixture includes both (c1) a silicone compound having an epoxy group and (c2) a silicone compound having an epoxy group and a polyalkylene ether group.