| 摘要 |
PROBLEM TO BE SOLVED: To provide a cover structure not using a liquid resin in a waterproofing structure of an LED module, not taking a long manufacturing time to be hardened, and applying ultrasonic bonding.SOLUTION: An LED module 100 capable of achieving complete waterproof with a very simple structure, has electric wire supporting tools 102 which are disposed at inner and outer sides of a case, and through which a cable C passes, a printed circuit board 110 disposed at an upper portion of the electric wire supporting tools, connected to the cable, and provided with an LED element, and a cover 120 fitting on an opened peripheral edge of the case to be connected. The cover has an opaque portion 122 having a light hole 121 for emitting the lit light from the LED element of the printed circuit board to the external, a transparent portion closing the light hole is formed at an inner side of the opaque portion by double injection molding together with the opaque portion so that it has a predetermined thickness, the transparent portion has an area agreed with the opaque portion, and peripheral edge portions at a side of side faces of the transparent portion and the opaque portion are simultaneously bonded to the case by ultrasonic wave. |
