Silicon-Based Heat Dissipation Device For Heat-Generating Devices

摘要

Embodiments of a silicon-based heat dissipation device and a chip module assembly are described. An apparatus may include a silicon-based heat dissipation device, an extended device coupled to the silicon-based heat-dissipation device and heat-generating devices mounted on the silicon-based heat dissipation device. The silicon-based heat dissipation device may include a base portion having a first primary side and a second primary side opposite the first primary side. The silicon-based heat dissipation device may also include a protrusion portion on the first primary side of the base portion and protruding therefrom. The protrusion portion may include multiple fins. The base portion may include a slit opening with a first heat-generating device of the heat-generating devices on a first side of the slit opening and a second heat-generating device of the heat-generating devices on a second side of the slit opening opposite the first side of the slit opening.

主权项

1. An apparatus, comprising:
a plurality of heat-generating devices; a silicon-based heat dissipation device comprising:
a base portion having a first primary side and a second primary side opposite the first primary side; anda protrusion portion on the first primary side of the base portion and protruding therefrom, the protrusion portion comprising a plurality of fins,wherein:
the second primary side of the base portion is configured to receive the heat-generating devices thereon such that at least a portion of heat generated by the heat-generating devices is dissipated to the silicon-based heat-dissipation device by conduction, andthe base portion comprises a slit opening with a first heat-generating device of the heat-generating devices on a first side of the slit opening and a second heat-generating device of the heat-generating devices on a second side of the slit opening opposite the first side of the slit opening; and an extended device coupled to the silicon-based heat-dissipation device, the extended device comprising:
an extended layer; andone or more spacers disposed between the extended layer and the silicon-based heat dissipation device.