SHIELDED SOCKETS FOR MICROPROCESSORS AND FABRICATION THEREOF BY OVERMOLDING AND PLATING

摘要

Shielded sockets for microprocessors and fabrication of shielded sockets by overmolding and plating techniques are described. In an example, a socket for a packaged semiconductor device includes a plastic housing having walls surrounding a cavity. A plurality of contact strips is disposed in the cavity and supported by one or more of the walls of the plastic housing. Each of the plurality of contact strips includes a plurality of contacts. Each of the plurality of contacts includes a vertical region overmolded with plastic, a contact portion, and a J-lead portion. The plastic is coated with a metal layer.

主权项

1. A method of fabricating a shielded socket for a packaged semiconductor device, the method comprising:
stamping one or more contact strips from a metal sheet, each contact strip comprising a plurality of contacts attached to a carrier by carrier arms; overmolding, with plastic, a vertical region of each of the plurality of contacts of each of the one or more contact strips; coating the plastic with a metal layer; forming bends in each of the plurality of contacts of each of the one or more contact strips to provide a contact tip and a J-lead in each of the plurality of contacts of each of the one or more contact strips; removing the carrier and carrier arms from each of the one or more contact strips; and inserting the one or more contact strips in a plastic housing.