Retrofit LED-Lamp

摘要

The invention relates to a retrofit LED lamp having an LED module, a driver circuit for supplying power to the LED module, a base for making mechanical and electrical contact with a bulb fitting and a heat sink arrangement for dissipating the heat produced during operation at the LED module and/or the driver circuit. The heat sink arrangement in this case has a metal mount insert consisting of a mount plate with an integrally attached collar, the mount plate bearing, in thermally conductive contact, the LED module, and a transparent upper shell being fitted to the collar of the mount insert in the light exit direction and a thermally conductive lower shell being fitted, in areal contact, in the direction of the base for heat dissipation, said upper shell and said lower shell together forming a housing of the LED lamp which surrounds the LED module and the mount insert.

主权项

1. A heat sink arrangement for dissipating the heat produced during operation at a light source, in particular at an LED module, and/or at a driver circuit for the light source, having:
a mount insert comprising a mount plate with an integrally attached collar, the mount plate bearing, in thermally conductive contact, the LED module, and a thermally conductive lower shell being fitted to the collar of the mount insert in areal contact in the direction of the base for heat dissipation in which the thermally conductive lower shell consists of at least one layer of a metal, a plastics material or a ceramic wherein the thermal conductivity of the plastics material or ceramic is greater than 1 watt/meter Kelvin, preferably greater than 2 watts/meter Kelvin, and wherein said heat sink arrangement consists of a single heat path from the mount insert to the thermally conductive lower shell.