CURABLE FLUX COMPOSITION AND SOLDER PASTE COMPRISING THE SAME

摘要

An embodiment of the present invention provides a curable flux composition comprising: a curable resin and a flux agent, where the flux agent includes one second-class amine group and two hydroxyl groups in a molecule, and includes a compound not including a carboxyl group or two third-class amine groups and four hydroxyl groups; and is selected among compounds not including the carboxyl group. According to the present invention, the curable flux composition prevents re-oxidation of a metal surface by removing oxides capable of existing on a contact surface on a substrate of an electronic device or a surface of a solder by acting as a flux during a soldering process; specifically, a reflow soldering process having a peak temperature section of approximately 200-300°C and improving a molten solder to the metal surface by degrading surface tension of the solder, and at the same time improving a soldering bonding strength and reliability by existing in a cured state at the time when the soldering process ends. Moreover, in case of performing soldering using the curable flux composition in accordance with the present invention, it is possible to simplify the soldering process and thereby reduce costs by not using an additional cleaning step of removing flux residue.