| 摘要 |
A wafer is divided into individual device chips along crossing division lines, the division lines being formed on the front side of the wafer to thereby define separate regions where devices are respectively formed. A division groove having a depth corresponding to the finished thickness of each device chip is formed along each division line on the front side of the wafer. The back side of the wafer is ground until the division groove along each division line is exposed to the back side of the wafer, thereby dividing the wafer into the individual device chips. An adhesive film for die bonding is mounted on the back side of the wafer and a dicing tape is attached to the adhesive film. The dicing tape is expanded to thereby break the adhesive film along the individual device chips. |
