发明名称 |
RESIN COMPOSITION, PREPREG, AND LAMINATE |
摘要 |
<p>[Problem to be Solved] It is an object to provide a prepreg for a printed laminate that has a low thermal expansion coefficient in the planar direction, excellent drillability, and further excellent heat resistance and flame retardancy, and a laminate and a metal foil-clad laminate. [Solution] A resin composition according to the present invention comprises a molybdenum compound (A); an epoxy resin (B); a curing agent (C); and an inorganic filler (D), wherein a Mohs hardness of the inorganic filler (D) is 3.5 or more, and a content of the inorganic filler (D) is 40 to 600 parts by mass based on 100 parts by mass of a total of resin solid components.</p> |
申请公布号 |
SG10201509881V(A) |
申请公布日期 |
2016.01.28 |
申请号 |
SG10201509881V |
申请日期 |
2012.01.18 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
KATO YOSHIHIRO;OGASHIWA TAKAAKI;TAKAHASHI HIROSHI;MIYAHIRA TETSURO |
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