发明名称 RESIN COMPOSITION, PREPREG, AND LAMINATE
摘要 <p>[Problem to be Solved] It is an object to provide a prepreg for a printed laminate that has a low thermal expansion coefficient in the planar direction, excellent drillability, and further excellent heat resistance and flame retardancy, and a laminate and a metal foil-clad laminate. [Solution] A resin composition according to the present invention comprises a molybdenum compound (A); an epoxy resin (B); a curing agent (C); and an inorganic filler (D), wherein a Mohs hardness of the inorganic filler (D) is 3.5 or more, and a content of the inorganic filler (D) is 40 to 600 parts by mass based on 100 parts by mass of a total of resin solid components.</p>
申请公布号 SG10201509881V(A) 申请公布日期 2016.01.28
申请号 SG10201509881V 申请日期 2012.01.18
申请人 MITSUBISHI GAS CHEMICAL COMPANY, INC. 发明人 KATO YOSHIHIRO;OGASHIWA TAKAAKI;TAKAHASHI HIROSHI;MIYAHIRA TETSURO
分类号 主分类号
代理机构 代理人
主权项
地址