BONDING METHOD AND METHOD OF MANUFACTURING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a bonding method capable of providing strong adhesive force without subjecting a second member to special treatment even when a thin film made of gold is formed on a surface of a first member.SOLUTION: A first member 11 is made of a material other than gold, and a thin film 12 made of gold is formed on its surface. A bonding method S1 includes: (1) an irradiation step S11 of irradiating at least part of a specific region 12a of the surface of the first member 11 with a laser beam to expose a base of the thin film 12 in the at least part of the specific region 12a; and (2) a bonding step S12 of bonding a second member 14 to the specific region 12a using an adhesive 13.