| 摘要 |
The present invention relates to a manufacturing method of a printed circuit board on which a light emitting element can be mounted. According to the present invention, the manufacturing method comprises the following steps: sequentially laminating a base metal layer, which is divided in a flat area and a bending area, an insulation layer, and a metal layer for a circuit; patterning the metal layer for a circuit, and forming a circuit pattern; forming a protective insulation layer where the light emitting element exposes the circuit pattern to be mounted in the flat area; and cutting the base metal layer where the insulation layer, the circuit pattern, and the protective insulation layer are formed in an upper portion to have a pre-designed shape. After any one among the step of sequentially laminating the base metal layer, the insulation layer, and the metal layer for a circuit, the step of forming the circuit pattern, the step of forming the protective insulation layer, and the step of cutting the base metal layer, a step of removing the base metal layer of the bending area by a mechanical process is performed in order to let the base metal layer corresponding to the bending area remain in a lower portion of the insulation layer. |
