发明名称 プリント配線板用ソルダーレジスト層及びその形成方法
摘要 PROBLEM TO BE SOLVED: To provide a high-reflectance white coating layer that can be favorably used as a solder resist or the like for a printed circuit board on which light-emitting components such as LEDs are to be mounted, to provide a method of forming the high-reflectance white coating layer, and to provide the printed circuit board using the high-reflectance white coating layer.SOLUTION: A white coating layer is composed of a coating film formed by using a white curable composition containing titanium oxide. The white coating layer is formed by laminating two or more layers of the coating film.
申请公布号 JP5849140(B2) 申请公布日期 2016.01.27
申请号 JP20140207573 申请日期 2014.10.08
申请人 太陽ホールディングス株式会社 发明人 日馬 征智;嶋宮 歩;宇敷 滋
分类号 H05K3/28 主分类号 H05K3/28
代理机构 代理人
主权项
地址