| 摘要 |
Provided is a method to manufacture an electronic component, capable of efficiently and conveniently manufacturing an electronic component including a via electrode (protrusion electrode) and a panel member. The present invention relates to manufacture an electronic component, sealing a chip (31) with resin. The manufactured electronic component includes a substrate (21), the chip (31), resin (41), a panel member (11), and a protrusion electrode (12). A wiring pattern (22) is formed on the substrate (21). The method includes a resin sealing process of sealing the chip (31) with the resin (41). In the resin sealing process, the protrusion electrode (12) is fixed to one side of the panel member (11), and the chip (31) is sealed with the resin (41) between a formation surface of the wiring pattern (22) of the substrate and a fixing surface of the protrusion electrode (12) on a protruding electrode-mounted panel (10), including a transformation part (12A) to contract the protrusion electrode (12) in a vertical direction to a surface direction of the panel member (11), while the protrusion electrode (12) is connected with the wiring pattern (22). |
