| 摘要 |
The present invention relates to a halogen-free resin composition as well as a prepreg and a laminated board used for a printed circuit that are made of the halogen-free resin composition. Based on 100 parts by weight of organic cured products, the resin composition comprises: (A) 30 to 60 parts by weight of bisphenol epoxy resin, (B) 5 to 45 parts by weight of benzoxazine resin, (C) 10 to 30 parts by weight of an alkyl phenol phenolic curing agent, and (D) phosphorus-containing flame retardant. The structure of the bisphenol epoxy resin contains many alkyl branched chains and benzene rings, so that the bisphenol epoxy resin has high glass transition temperature, low absorption of water, good thermal resistance and excellent dielectric performance. The alkyl phenol phenolic is used as the curing agent, which makes full use of the advantages of the alkyl phenol phenolic that the alkyl phenol phenolic has many alkyl groups and thus has excellent dielectric performance and low absorption of water. The prepreg and the laminated board used for a printed circuit that are made of the halogen-free thermosetting resin composition have high glass transition temperature, low dielectric constant, low dielectric loss factor, low absorption of water, high thermal resistance and good flame retardancy, processing performance and chemical resistance. |
