发明名称 MOLDED DIE SLIVERS WITH EXPOSED FRONT AND BACK SURFACES
摘要 In one example, a process for making a micro device structure includes molding a micro device in a monolithic body of material and forming a fluid flow passage in the body through which fluid can pass directly to the micro device.
申请公布号 EP2976221(A1) 申请公布日期 2016.01.27
申请号 EP20140770591 申请日期 2014.03.18
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 CHEN, CHIEN-HUA;CUMBIE, MICHAEL, W.
分类号 B41J2/14 主分类号 B41J2/14
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