| 摘要 |
A mobile terminal is provided. The mobile terminal comprises: a case including an electric filed portion having electronic components embedded therein; a display unit coupled to the front surface of the case; a frame coupled to the case by supporting the rear surface of the display unit and including metal materials; a main substrate mounted onto the case; a driver IC mounted onto the main substrate; a shield can having an opening formed at a position corresponding to the driver IC and covering components mounted on the main substrate; a conductive tape combining the frame and the shield can; and a thermal diffusion sheet which is in contact with the driver IC and whose end portion comes into contact with the inner surface of the shield can, wherein the main substrate and the thermal diffusion sheet are spaced apart from each other. The mobile terminal prevents a shock from being transmitted to an application processor when a shock is applied, while increasing heat dissipation efficiency of heat generated in the application processor of the mobile terminal. |
