| 摘要 |
The method for manufacturing a piezoelectric substrate includes a process of forming a material having composition M1−y/2+x(N1−yNby)O3+x (where 0≦̸y≦̸0.045, M represents Pb1−pSrp with 0≦̸p≦̸0.03, and N represents Ti1−qZrq with 0.45≦̸q≦̸0.60) into a sheet form, and a process of burning the material formed into the sheet form while mounted on a setter to obtain a piezoelectric substrate. A thickness of the piezoelectric substrate is 30 μm or less, and a surface area/thickness ratio of the piezoelectric substrate is 1×107 μm or more. The variable x has a value within or on a boundary of a region R shown by hatching in FIG. 1. |
