| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which can inhibit a void in a connection pad caused by electromigration. <P>SOLUTION: A wiring board comprises: an insulation substrate 1 having a mounting part 1a of a semiconductor element 4 on a top face; a through conductor 3 composed of copper polycrystal containing a glass component and formed from the mounting part 1a to the inside of the insulation substrate 1; and a connection layer 2 composed of copper polycrystal having an average grain diameter larger than that of copper crystal forming the through conductor 3 and formed so as to cover an end face of the through conductor 3 on the mounting part 1a. Crystal orientation of copper forming the connection layer 2 is non-orientation. An electrode 5 of the semiconductor element 4 is electrically connected with the connection layer 2 via a solder 6. <P>COPYRIGHT: (C)2013,JPO&INPIT |
