| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the strength and heat resistance of Pb-free solder after being melted and solidified, and to improve wettability between the molten Pb-free solder and a terminal electrode. <P>SOLUTION: Bond metal 10 which is obtained by melting and solidifying a Pb-free solder is interposed among an electronic component 2, a circuit board 3 to be mounted with the electric component 2, a terminal electrode 2T of the electronic component 2, and a terminal electrode 3T of the circuit board 3, and the electronic component and the circuit board are connected to each other. The bond metal 10 has: a first metal phase containing Ni-Fe alloy as a principal component; a second metal phase containing Sn alloy as a principal component and surrounding the first metal phase; and a third metal phase containing Sn as a principal component. The Pb-free solder contains: first metal particles containing Sn as a principal component; and second metal particles in which the surfaces of core particles containing Ni-Fe alloy as a principal component are covered with at least one coating layer containing as a principal component, Sn and a metal that forms an alloy. <P>COPYRIGHT: (C)2012,JPO&INPIT |
