| 摘要 |
This invention disclosures a process for metalizing the surface of a ceramic and a process for attaching a ceramic to a metal. A process for attaching an aluminum or aluminum alloy thin film to a ceramic surface comprises the steps of: immersing a ceramic surface to be metalized into a aluminum or aluminum alloy melt, and making the ceramic move or stay still relative to the melt to adhere the melt of the aluminum or aluminum alloy to the metalizing surface of the ceramic; and then removing the metalizing surface of the ceramic from the melt to unaffectedly cool the aluminum or aluminum alloy liquid film adhered thereto to obtain a ceramic having the aluminum or aluminum alloy thin film attached to the surface. The process to attaching aluminum or aluminum alloy thin film on the surface of a ceramic of the present invention can attach an aluminum or aluminum alloy thin film having a thickness of several micrometers to tens of micrometers on the surface of a ceramic. The thin film isformed by the solidification of the aluminum of aluminum alloy liquid film attached on the surface of a ceramic, and it does not have the microscopic faults such as oxide film inclusions or pores, therefore having the proper physical of mechanical properties of aluminum. Ceramics or a ceramic and a metal can be brazed via the surface metalizing film, the bonding strength of their interface can over the strength of aluminum itself. |
