| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic device capable of preventing deterioration in solderability due to decomposition of a lead frame exposed in a dicing process. <P>SOLUTION: A manufacturing method of a semiconductor device 10 as an electronic device comprises the steps of: forming mounting electrode portions 11 that have surfaces and stepped portions of pad portions 12 and are provided with recessed portions 17 surrounded by the pad portions 12; preparing a lead frame 20 with a metal film 13 formed on a surface thereof; forming mold resin 16M as a sealing portion by resin so as to expose the surfaces and the recessed portions 17 of the pad portions 12; and obtaining the diced semiconductor device 10 by cutting the pad portions 12, the recessed portions 17 and the sealing portion 16. <P>COPYRIGHT: (C)2013,JPO&INPIT |
