| 摘要 |
The present invention relates to a cutting residual removing device, and aims for improving the finished production rate of wafers. According to the cutting residual removing device, fluid is sprayed by a first nozzle (30), an interval is disposed between a cutting residual portion (601) and a wafer column (60), a maintaining arm (710) enables the cutting residual portion (601) to rotate, the interval between the cutting residual portion (601) and the wafer column (60) is broadened, so as to enable a cutting sheet base seat (50) to depart with the cutting residual portion (601), so that the cutting residual portion (601) is allowed to move along a depart direction from the cutting residual portion (601), and therefore the cutting residual portion (601) is removed from the cutting sheet base seat (50). When the wafer (600) is taken out, quality abnormality of cracking and notch existing of the wafer (600) due to the contact of the wafer (600) and the cutting residual portion (601) is avoided, and the finished product rate of the wafer is improved further. |
