Paste comprising first metal particles and a polar solvent with a second metal dissolved therein, cured product obtained therefrom, and semiconductor device comprising the cured product

摘要

A metallic particle paste (10) includes a polar solvent (4) and particles (10) dispersed in the polar solvent and containing a first metal. A second metal different from the first metal is dissolved in the polar solvent. The second metal is present in solvent (10) of the metallic particle paste (10) in the form of a complex ion, an organometallic ion or an ion of a metal salt. The paste (10) may be used for forming wiring and a heat-radiation portion of an electronic substrate or for bonding members (5, 7) in a semiconductor device through a bonding layer (6).