发明名称 FILM-FORMING METAL SOLUTION AND METAL FILM-FORMING METHOD
摘要 A film-forming metal solution for supplying metal ions to a solid electrolyte membrane in film formation is provided. In the film formation, the solid electrolyte membrane is disposed between an anode and a substrate as a cathode, and the solid electrolyte membrane is brought into contact with the substrate and a voltage is placed between the anode and the substrate to precipitate a metal on a surface of the substrate from the metal ions contained in the solid electrolyte membrane, so that a metal film of the metal is formed on the surface of the substrate. The film-forming metal solution contains a solvent, and the metal dissolved in the solvent in an ionic state. A hydrogen ion concentration of the film-forming metal solution is within a range of 0 to 10 -7.85 mol/L at 25°C.
申请公布号 EP2977488(A1) 申请公布日期 2016.01.27
申请号 EP20150177944 申请日期 2015.07.22
申请人 TOYOTA JIDOSHA KABUSHIKI KAISHA 发明人 HIRAOKA, MOTOKI;YANAGIMOTO, HIROSHI;SATO, YUKI;AKAMATSU, KENSUKE
分类号 C25D3/00;C25D3/02;C25D5/08 主分类号 C25D3/00
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