发明名称 Flexible electronic component module
摘要 A flexible electronic component module includes a first substrate and a second substrate. The first substrate overlaps the second substrate to define at least one first exposed portion and at least one second exposed portion. The at least one first exposed portion includes a first electrode layer and the at least one second exposed portion includes a second electrode layer. The first electrode layer is disposed on a lower surface of the first substrate and the second electronic layer is disposed on an upper surface of the second substrate.
申请公布号 US9247653(B2) 申请公布日期 2016.01.26
申请号 US201314106231 申请日期 2013.12.13
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 Chen Chang Yi;Hsieh Yung Min;Liou Chang Ho
分类号 H05K7/06;H05K3/36;H05K1/02;H05K3/32 主分类号 H05K7/06
代理机构 WPAT, P.C. 代理人 WPAT, P.C. ;King Anthony
主权项 1. A flexible electronic component module, comprising: a first substrate including a first electrode layer on a lower surface thereof; a second substrate including a second electrode layer on an upper surface thereof; and a plurality of electrodes between the first electrode layer and the second electrode layer, and the plurality of electrodes being spaced apart by a first distance; wherein the first substrate overlaps the second substrate to define a first exposed portion and a second exposed portion; wherein the first exposed portion comprises a first side and a second side, the first side being positioned more distant than the second side, the second exposed portion comprises a third side and a fourth side, the third side being positioned more distant than the fourth side, and the first distance is equal to a second distance from the second side to the center of one of the plurality of electrodes closest to the second side plus a third distance from the third side to the center of one of the plurality of electrodes closest to the third side.
地址 Hsinchu TW