Semiconductor packaging apparatus formed from semiconductor package including first and second solder balls having different heights

摘要

According to example embodiments of inventive concepts, a semiconductor package apparatus includes a first semiconductor package including a first substrate, a first solder resist layer on the first substrate, and a first sealing member that covers and protects the first solder resist layer, and a plurality of solder balls on the first substrate. The plurality of solder balls includes a first solder ball having a first height and a second solder ball having a second height that is different from the first height. The first sealing member includes holes that expose the solder balls.

主权项

1. A semiconductor package apparatus comprising:
a first semiconductor package including,
a first substrate, the first substrate including a chip-mounting area at a central portion and a peripheral area surrounding the chip-mounting area,a first solder resist layer on the first substrate, and a first sealing member that covers and protects the first solder resist layer,
the first sealing member defining holes; and a plurality of solder balls on the first substrate,
the plurality of solder balls including a first solder ball having a first height and a second solder ball having a second height that is different from the first height, both the first solder ball and the second solder ball being on top of the peripheral area, andthe plurality of solder balls being exposed by the holes of the first sealing member.