发明名称 Carrier for flexible substrate, substrate processing apparatus including the carrier, and method of manufacturing flexible display apparatus
摘要 Provided is a carrier for a flexible substrate which is capable of handling a flexible substrate during a flexible substrate processing process, while allowing the flexible substrate to be easily separated. Also provided is a substrate processing apparatus, including the carrier, and a method of manufacturing a flexible display apparatus. The carrier includes a substrate supporting portion having a top surface including a mounting surface, an outer circumferential surface, surrounding the mounting surface, and a first heat cutting portion. The first heat cutting portion is located outside the mounting surface so as to be exposed on the top surface and generates heat when a current flows through the first heat cutting portion.
申请公布号 US9246124(B2) 申请公布日期 2016.01.26
申请号 US201314089537 申请日期 2013.11.25
申请人 Samsung Display Co., Ltd. 发明人 Khachatryan Hayk
分类号 H01L21/00;H01L51/52;G02F1/1333;H01L51/00 主分类号 H01L21/00
代理机构 Christie, Parker & Hale, LLP 代理人 Christie, Parker & Hale, LLP
主权项 1. A method of manufacturing a flexible display apparatus, the method comprising: preparing a carrier for a flexible substrate, wherein the carrier comprises a substrate supporting portion having a top surface comprising a mounting surface,an outer circumferential surface surrounding the mounting surface, anda first heat cutting portion located outside the mounting surface so as to be exposed on the top surface, the first heat cutting portion being configured to generate heat when a current flows through the first heat cutting portion; disposing the flexible substrate over the mounting surface and the outer circumferential surface; and separating a portion of the flexible substrate from a remaining portion by using heat generated in the first heat cutting portion.
地址 Yongin-si KR