Heat dissipation structure and handheld electronic device with the heat dissipation structure

摘要

A heat dissipation structure includes a heat conduction support body disposed in a handheld electronic device. The heat conduction support body has a first face and a second face opposite to the first face. A chamber is defined between the first and second faces. More than one capillary structure and a working fluid are disposed in the chamber. One of the first and second faces or both of the first and second faces are in contact with the electronic components of the handheld electronic device. One of the first and second faces is in contact with the housing of the handheld electronic device. Accordingly, the heat generated by the electronic components can be quickly conducted and dissipated outward.

主权项

1. A mid frame with heat dissipation applicable to a handheld electronic device, the handheld electronic device having a housing in which a plurality of internal electronic components are arranged, the mid frame having a first face and a second face opposite to the first face, a closed heat-dissipating chamber being defined between the first and second faces, a capillary structure and a working fluid being disposed in the chamber, one of the first and second faces or both of the first and second faces having a plurality of depression portions positioned to accommodate and directly contact a full area of corresponding internal electronic components of the handheld electronic device.