发明名称 Mechanism for employing and facilitating placement of a sensor cover over a capacitive circuitry sensor at a computing device
摘要 A mechanism is described for employing and facilitating placing a sensor cover over an external sensor of a computing device. A method of embodiments of the invention includes sensing, at a sensor of a computing device, user touches to an outer surface of an impregnated sensor cover placed over the sensor, wherein the sensor cover includes a plurality of holes through the outer surface and a plurality of conductive leads corresponding to the plurality of holes, and wherein sensing is performed through one or more of the plurality of holes and their one or more corresponding conductive leads; and facilitating an action in response to each of the sensed user touches.
申请公布号 US9244577(B2) 申请公布日期 2016.01.26
申请号 US201113977439 申请日期 2011.09.30
申请人 Intel Corporation 发明人 Graumann David L.;Williams Jameson H.
分类号 G06F3/041;G06F3/044;H03K17/96 主分类号 G06F3/041
代理机构 Blakely, Sokoloff, Taylor & Zafman LLP 代理人 Blakely, Sokoloff, Taylor & Zafman LLP
主权项 1. A method comprising: placing an outer sensing surface over a sensor of a computing device, wherein the outer sensing surface to serve as an enclosure over the sensor and wherein the outer sensing surface is impregnated with a plurality of holes corresponding to a plurality of conductive lines leading to the sensor; sensing a user touch to the outer sensing surface, wherein sensing is performed through one or more of the plurality of holes and correspondingly through one or more of the plurality of conductive leads such that the outer sensing surface serves to replace the sensor while the sensor remains untouched and unaltered; and facilitating an action in response to the user touch.
地址 Santa Clara CA US