发明名称 Power semiconductor device and method of manufacturing the same
摘要 A power semiconductor device may include: a base substrate including a first conductive type drift layer; a second conductive type semiconductor substrate disposed on the other surface of the base substrate; a first conductive type diffusion layer disposed in the base substrate and having an impurity concentration higher than that of the drift layer; a second conductive type well layer disposed inside of one surface of the base substrate; a trench formed from one surface of the base substrate including the well layer so as to penetrate through the diffusion layer in a depth direction; a first insulation film disposed on a surface of the base substrate; and a first electrode disposed in the trench. A peak point of an impurity doping concentration of the diffusion layer in a transverse direction may be positioned in a region contacting a side surface of the trench.
申请公布号 US9245986(B2) 申请公布日期 2016.01.26
申请号 US201414322346 申请日期 2014.07.02
申请人 Samsung Electro-Mechanics Co., Ltd. 发明人 Song In Hyuk;Park Jae Hoon;Seo Dong Soo;Jang Chang Su
分类号 H01L29/78;H01L29/00;H01L21/336;H01L29/739;H01L29/66;H01L21/265;H01L29/36 主分类号 H01L29/78
代理机构 Ladas & Parry, LLP 代理人 Ladas & Parry, LLP
主权项 1. A power semiconductor device comprising: a base substrate having one surface and an other surface opposing the one surface and comprising a first conductive type drift layer; a second conductive type semiconductor substrate disposed on the other surface of the base substrate; a second conductive type well layer disposed under the one surface of the base substrate; a first conductive type diffusion layer disposed in the base substrate, formed to be spaced apart from the well layer in a first direction, and having an impurity concentration higher than that of the drift layer; a trench formed from the one surface of the base substrate including the well layer so as to penetrate through the diffusion layer in the first direction; an insulation film disposed on the one surface of the base substrate including an inner wall of the trench; and a first electrode disposed in the trench, wherein a peak point of an impurity doping concentration of the diffusion layer in a second direction perpendicular to the first direction is positioned in a region contacting a side surface of the trench.
地址 Gyeonggi-Do KR