Metal pads with openings in integrated circuits

摘要

A device includes a metal pad, and a passivation layer including portions overlapping edge portions of the metal pad. A Post-Passivation-Interconnect (PPI) includes a trace portion overlying the passivation layer, and a pad portion connected to the trace portion. A polymer layer includes an upper portion over the PPI, and a plug portion extending into, and encircled by, the pad portion of the PPI.

主权项

1. A device comprising:
a metal pad; a passivation layer comprising portions overlapping edge portions of the metal pad, wherein the metal pad and the passivation layer are comprised in a chip; a Post-Passivation-Interconnect (PPI) comprising:
a trace portion overlying the passivation layer; anda pad portion connected to the trace portion; and a first polymer layer comprising:
an upper portion over the PPI; anda plug portion extending into, and encircled by, the pad portion of the PPI, wherein the plug portion penetrates through the pad portion, with a bottom surface of the plug portion connected to a bottom surface of the pad portion to form a substantially continuous bottom surface; a molding material encircling the chip; and a second polymer layer over the metal pad, wherein a top surface of the molding material and a top surface of the second polymer layer are substantially in a same horizontal plane parallel to a top surface of the metal pad.