Area array device connection structures with complimentary warp characteristics

摘要

A method for designing structures with complimentary dynamic warp characteristics for attachment of a component to a PC board is disclosed. The method may include determining characteristics of thermally induced dynamic warp of the PC board and of the first component, analyzing and comparing differences between the dynamic warp characteristics of the PC board and the first component and selecting design modifications to match PC board and the first component dynamic warp characteristics. Selecting design modifications may include determining if the first component dynamic warp characteristics can be changed, determining if matching the dynamic warp characteristics of the PC board and the first component can be achieved by modifying the design of at least one of the PC board and the first component. The result of the method may be modified dynamic warp characteristics of at least one of the PC board and the first component.

主权项

1. A computerized method for providing design data representing component attachment structures with complimentary dynamic warp characteristics for attachment of a first component in a first locality on a PC board, the method comprising:
using a computer to perform the following:
determining the warp characteristics of thermally induced dynamic warp of the PC board and of the first component, wherein the warp characteristics include magnitude and direction of warp;analyzing and comparing differences between the dynamic warp characteristics of the PC board and the first component;selecting design modifications to match the dynamic warp characteristics of the PC board and the first component, the selecting further comprising:
determining if the first component dynamic warp characteristics can be changed;determining if matching the dynamic warp characteristics of the PC board and the first component can be achieved by modifying the design of at least one of the PC board and the first component;selecting design characteristics of at least one of the PC board and the first component to modify; andmodifying the design data representing the design of at least one of the PC board and the first component, resulting in modified dynamic warp characteristics of at least one of the PC board and the first component; andproviding the design data, based on the modified design, for manufacturing the PC board; andmanufacturing the PC board based on the provided design data.