| 摘要 |
A high-frequency copper claded laminate for use in an operational frequency of at least 1 GHz possesses properties of dielectric constant (Dk) less than 3.2, dissipation factor (Df) less than 0.005, high glass transition temperature, high thermal stability and low moisture absorption; the laminate contains a tack-free prepreg constituted by a reinforcement impregnated with an inventive resin mixture at least comprising a high-molecular-weight polybutadiene resin, a low-molecular-weight polybutadiene resin, a modified thermosetting polyphenylene ether resin and an inorganic powder; and particularly the tack-free prepreg can be processed into the copper claded laminates through automated layup processing to satisfy a long-felt but unmet needs in the filed of producing copper claded laminate. |
| 主权项 |
1. A compound material applicable to a high-frequency circuit board, the compound material having a property of undergoing a hot-pressing process under 170-190° C. as well as having a high glass transition temperature after cured more than 200° C. and consisting of 10-50 wt % of a reinforcement and 50-90 wt % of a resin mixture, wherein the reinforcement is selected from the group consisting of non-woven fiberglass cloth, non-woven liquid-crystalline polymer fiber, synthetic fiber cloth, carbon fiber cloth, PP cloth, PTFE cloth and non-woven cloth, and wherein the resin mixture consisting of:
(a) a high-molecular-weight polybutadiene resin, containing more than 70 wt % high-vinyl groups, having a weight-average molecular weight (MW) greater than 100,000 g/mol, and taking in an amount greater than zero and equal to or less than 15 wt % of a total solid content of the resin mixture; (b) a low-molecular-weight polybutadiene resin, containing more than 70 wt % high-vinyl groups, having a weight-average molecular weight (MW) ranging between 1,000 and 10,000 g/mol, and taking 10-40 wt % of the total solid content of the resin mixture; (c) a modified thermosetting polyphenylene ether resin, having a weight-average molecular weight (MW) ranging between 1,000 and 5,000 g/mol, taking 5-35 wt % of the total solid content of the resin mixture, and being a thermosetting polyphenylene ether resin whose two terminals are modified with hydroxyl, methacrylate, vinyl, styryl, amino or epoxy groups; (d) an inorganic powder, taking 0.1-50 wt % of the total solid content of the resin mixture; (e) a flame retardant, taking 10-35 wt % of the total solid content of the resin mixture; (f) a cross-linking agent serves to enhance the cross-linking level of the thermosetting resin, taking 2-10 wt % of the total solid content of the resin mixture; wherein the cross-linking agent is one or more selected from the group consisting of triallyl cyanurate, triallylisocyanurate (TAIC), diallyl phthalate, divinylbenzene and 1,2,4-triallyltrimellitate; (g) a binding promoter serves to enhance the binding strength between the resin and a copper foil covered thereon, taking 1-10 wt % of the total solid content of the resin mixture, wherein the binding promoter is a metal coagent, a mercapto-type-accelerator or a combination thereof; and (h) a curing initiator; taking 0.1-3 wt % of the total solid content of the resin mixture; wherein, a total content of (a) through (c) takes 30-60 wt % of the total solid content of the resin mixture. |
