Hermetic encapsulation for microelectromechanical systems (MEMS) devices

摘要

Embodiments of the invention describe hermetic encapsulation for MEMS devices, and processes to create the hermetic encapsulation structure. Embodiments comprise a MEMS substrate stack that further includes a magnet, a first laminate organic dielectric film, a first hermetic coating disposed over the magnet, a second laminate organic dielectric film disposed on the hermetic coating, a MEMS device layer disposed over the magnet, and a plurality of metal interconnects surrounding the MEMS device layer. A hermetic plate is subsequently bonded to the MEMS substrate stack and disposed over the formed MEMS device layer to at least partially form a hermetically encapsulated cavity surrounding the MEMS device layer. In various embodiments, the hermetically encapsulated cavity is further formed from the first hermetic coating, and at least one of the set of metal interconnects, or a second hermetic coating deposited onto the set of metal interconnects.

主权项

1. An apparatus comprising:
a microelectromechanical systems (MEMS) substrate stack comprising:
a magnet;a first laminate organic dielectric film;a first hermetic coating disposed over a portion of the substrate stack;a second laminate organic dielectric film disposed on the first hermetic coating;a MEMS device layer disposed over the magnet; anda plurality of metal interconnects surrounding the MEMS device layer; and a hermetic plate bonded to the MEMS substrate stack and disposed over the formed MEMS device layer to at least partially form a hermetically encapsulated cavity surrounding the MEMS device layer; wherein the hermetically encapsulated cavity is further formed from the first hermetic coating, and at least one of:
the set of metal interconnects;a second hermetic coating deposited onto the set of metal interconnects.