| 摘要 |
According to one embodiment of the present invention, an LED assembly includes: a base substrate including a wiring layer non-formed region and a wiring layer formed region; an insulating layer and a wiring layer sequentially stacked in the wiring layer formed region; and a light emitting diode (LED) of which a lead part is disposed on the wiring layer and a radiating part is disposed on the base substrate. The LED is a side view type. |
