| 摘要 |
The present invention relates to an apparatus for reprocessing a polishing plate, capable of managing flatness through a polishing process even if a distortion is generated as a plate for a wafer polishing apparatus is used. The present invention provides an apparatus for reprocessing a polishing plate which includes a base body which is rotatably installed; a base which is fixed to the base body, and mounted with the polishing plate; a slurry supply part which supplies slurry onto the plate placed on the base; a polishing tool which polishes the plate placed on the base; and a polishing driving part which fixates the polishing tool to be rotated and moved. |
