发明名称 Nitride-based semiconductor substrate and semiconductor device
摘要 A nitride-based semiconductor substrate has a diameter of 25 mm or more, a thickness of 250 micrometers or more, a n-type carrier concentration of 1.2×1018 cm−3 or more and 3×1019 cm−3 or less, and a thermal conductivity of 1.2 W/cmK or more and 3.5 W/cmK or less. Alternatively, the substrate has an electron mobility μ [cm2/Vs] of more than a value represented by logeμ=17.7−0.288 logen and less than a value represented by logeμ=18.5−0.288 logen, where the substrate has a n-type carrier concentration n [cm−3] that is 1.2×1018 cm−3 or more and 3×1019 cm−3 or less.
申请公布号 US9246049(B2) 申请公布日期 2016.01.26
申请号 US200812222907 申请日期 2008.08.19
申请人 SCIOCS COMPANY LIMITED 发明人 Oshima Yuichi
分类号 H01L29/20;H01L33/00;C30B25/02;C30B29/40;H01L21/02 主分类号 H01L29/20
代理机构 McGinn IP Law Group, PLLC 代理人 McGinn IP Law Group, PLLC
主权项 1. A nitride-based semiconductor substrate comprising a nitride-based semiconductor material, the nitride-based semiconductor substrate having: a diameter of 25 mm or more; a thickness of 250 micrometers or more; an n-type carrier concentration in a range of 1.2×1018 cm−3 to 3×1019 cm−3; and a thermal conductivity in a range of 1.2 W/cmK to 3.5 W/cmK.
地址 Hitachi-shi, Ibaraki-ken JP
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